Thank you for taking interest in Thales Sa part number 91793094, which is listed with the NSN 5962-01-576-4945 and a product description of “Microcircuit Linear.” In order to receive procurement options on this particular listing, we ask that you fill out and submit the form provided below with as much information as you can concerning your needs. By supplying our staff with key details on your desired quantity, pricing target, and expedited fulfillment timeframe, we can respond with a quote that has been specifically tailored to your unique specifications. We also ask that you make us aware of any restrictions that you may have as soon as possible, such as if you have a time constraint or are seeking unlisted items.
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Alongside part number 91793094, you are encouraged to continue exploring our collection curated catalogs to find additional items that can accompany this Microcircuit Linear part with the NSN 5962-01-576-4945. For example, you can browse other Thales Sa components that were produced under CAGE Code F6481 or listings that belong to FSC 5962 Microcircuits Electronic with ease on our website, with search tools provided for quick location. Furthermore, our staff is just a call or email away from assisting you with any inquiries or requests, so be sure to get started on the quotation process for part number 91793094 and other desired offerings on Aerospace Spare.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-576-4945 Item PartTypeName: MICROCIRCUIT,LINEAR | 5962 | 015764945 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91793094 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | Part Name Assigned By Controlling Agency | LOW STRESS INJECTION MOLDED PLASTIC |
| MRC | Decoded Requirement | Clear Text Reply |
| FEAT | Special Features | LEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES |
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