Thank you for taking interest in Microsemi Corporation part number UPS840, which is listed with the NSN 5961-01-603-6861 and a product description of “Semiconductor Device Diode.” In order to receive procurement options on this particular listing, we ask that you fill out and submit the form provided below with as much information as you can concerning your needs. By supplying our staff with key details on your desired quantity, pricing target, and expedited fulfillment timeframe, we can respond with a quote that has been specifically tailored to your unique specifications. We also ask that you make us aware of any restrictions that you may have as soon as possible, such as if you have a time constraint or are seeking unlisted items.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-603-6861 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 016036861 | N | A | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
A | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
UPS840 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CTQN | Voltage Rating In Volts Per Characteristic | 40.0 NOMINAL NOMINAL REGULATOR VOLTAGE |
AKPV | Mounting Facility Quantity | 3 |
AXGY | Mounting Method | TERMINAL |
ABKW | Overall Height | 0.040 INCHES NOMINAL |
MRC | Decoded Requirement | Clear Text Reply |
ABHP | Overall Length | 0.256 INCHES NOMINAL |
ABJT | Terminal Length | 0.027 INCHES NOMINAL AND 0.056 INCHES NOMINAL |
ABMK | Overall Width | 0.160 INCHES NOMINAL |
ABBH | Inclosure Material | PLASTIC |
FEAT | Special Features | LOW PROFILE-MAXIMUM HEIGHT OF 1.1MM;FOOTPRINT AREA OF 16.51 MM SQUARED;LOW THERMAL TESISTANCE WITH DIRECT THERMAL PATH ON DIE ON EXPOSED CATHODE HEAT SINK;CASE IS MOLDED EPOXY |
TTQY | Terminal Type And Quantity | 3 TAB, SOLDER LUG |
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