Thank you for taking interest in Lockheed Martin Corporation part number 7917503-00, which is listed with the NSN 5962-01-346-1900 and a product description of “Microcircuit Hybrid.” In order to receive procurement options on this particular listing, we ask that you fill out and submit the form provided below with as much information as you can concerning your needs. By supplying our staff with key details on your desired quantity, pricing target, and expedited fulfillment timeframe, we can respond with a quote that has been specifically tailored to your unique specifications. We also ask that you make us aware of any restrictions that you may have as soon as possible, such as if you have a time constraint or are seeking unlisted items.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-346-1900 Item PartTypeName: MICROCIRCUIT,HYBRID | 5962 | 013461900 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
7917503-000 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 1.535 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 2.090 INCHES NOMINAL |
ADAQ | BODY LENGTH | 1.535 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | FUNCTION DRIVER,BUBBLE MEMORY |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |
ABKW | OVERALL HEIGHT | 0.220 INCHES MAXIMUM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
ADAT | BODY WIDTH | 1.150 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.220 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -40.0 TO 85.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HYBRID AND HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
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