| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-416-0409 (014160409) |
| NCB Code | USA (01) |
| Manufacturer | Raytheon Company, Texas Instruments Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 3129300-0003 | raytheon company | microcircuit memory | 96214 | RFQ |
| CF68011HFG | texas instruments inc | microcircuit memory | 01295 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 2.540 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 2.540 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.103 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | F-16" |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR" |
| CRTL | CRITICALITY CODE JUSTIFICATION | CBBL" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 BEAM LEAD" |
| ADAQ | BODY LENGTH | 2.540 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 2.540 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.103 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | F-16" |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR" |
| CRTL | CRITICALITY CODE JUSTIFICATION | CBBL" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 196 BEAM LEAD" |
| Relevant Components for NSN - 5962-01-416-0409, 5962014160409 | ||||
| 5975-01-629-6429 (5975016296429) | 5998-01-305-2341 (5998013052341) | 5930-01-584-0809 (5930015840809) | 5962-01-210-3065 (5962012103065) | |
| 5905-00-175-4284 (5905001754284) | 5950-01-458-0903 (5950014580903) | 5920-01-490-0904 (5920014900904) | 5998-01-475-9891 (5998014759891) | |
| 5995-01-575-7529 (5995015757529) | 5962-01-310-7304 (5962013107304) | 5935-01-240-1468 (5935012401468) | 5995-01-374-0247 (5995013740247) | |
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