Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-188-8743 (011888743) |
NCB Code | USA (01) |
Manufacturer | Dla Land And Maritime, Military Specifications, Bae Systems Inc, Lockheed Martin Corporation, National Semiconductor Corporation, Mmi Amd, Advanced Micro Devices Inc |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
ROM PROM HEAD 048 | dla land and maritime | microcircuit memory | 16236 | RFQ |
5962-3850402BRA | military specifications | microcircuit memory | 81349 | RFQ |
312396-004 | bae systems inc | microcircuit memory | 81413 | RFQ |
1983-7194 | lockheed martin corporation | microcircuit memory | 08241 | RFQ |
PAL16R8A | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
5962-3850402BRX | military specifications | microcircuit memory | 81349 | RFQ |
5962-3850402BRB | military specifications | microcircuit memory | 81349 | RFQ |
MIL-M-38510/504 | military specifications | microcircuit memory | 81349 | RFQ |
M38510/50402BRA | military specifications | microcircuit memory | 81349 | RFQ |
PAL 16R8A | mmi amd | microcircuit memory | 50364 | RFQ |
5962-8983903RA | dla land and maritime | microcircuit memory | 67268 | RFQ |
PAL 16RA8AMJ 883B | mmi amd | microcircuit memory | 50364 | RFQ |
PAL16R8-2MJ883B | mmi amd | microcircuit memory | 50364 | RFQ |
PAL16R8ADMB | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
DMPAL16R8A 883B | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT SINK |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 12.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/504 GOVERNMENT SPECIFICATION |
Relevant Components for NSN - 5962-01-188-8743, 5962011888743 | ||||
5975-01-629-6429 (5975016296429) | 5998-01-305-2341 (5998013052341) | 5930-01-584-0809 (5930015840809) | 5962-01-210-3065 (5962012103065) | |
5905-00-175-4284 (5905001754284) | 5950-01-458-0903 (5950014580903) | 5920-01-490-0904 (5920014900904) | 5998-01-475-9891 (5998014759891) | |
5995-01-575-7529 (5995015757529) | 5962-01-310-7304 (5962013107304) | 5935-01-240-1468 (5935012401468) | 5995-01-374-0247 (5995013740247) | |
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